| 9530738 |
Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant |
Linda Pei Ee Chua, Reza A. Pagaila |
2016-12-27 |
| 9524938 |
Package-in-package using through-hole via die on saw streets |
Heap Hoe Kuan, Seng Guan Chow |
2016-12-20 |
| 9449932 |
Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die |
Arnel Senosa Trasporto, Linda Pei Ee Chua, Reza A. Pagaila |
2016-09-20 |
| 9443828 |
Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation |
Reza A. Pagaila, Linda Pei Ee Chua |
2016-09-13 |
| 9431331 |
Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure |
Reza A. Pagaila, Linda Pei Ee Chua |
2016-08-30 |
| 9418941 |
Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP |
Reza A. Pagaila |
2016-08-16 |
| 9412624 |
Integrated circuit packaging system with substrate and method of manufacture thereof |
Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Kyung-Moon Kim, Jeffrey D. Punzalan, SeungYong Chai +3 more |
2016-08-09 |
| 9406619 |
Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die |
Reza A. Pagaila, Dioscoro A. Merilo |
2016-08-02 |
| 9406647 |
Extended redistribution layers bumped wafer |
Heap Hoe Kuan |
2016-08-02 |
| 9368423 |
Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package |
Arnel Senosa Trasporto, Linda Pei Ee Chua, Asri Yusof |
2016-06-14 |
| 9343429 |
Semiconductor device and method of forming double-sided through vias in saw streets |
Reza A. Pagaila |
2016-05-17 |
| 9331002 |
Semiconductor device and method of forming through vias with reflowed conductive material |
Reza A. Pagaila, Linda Pei Ee Chua |
2016-05-03 |
| 9324641 |
Integrated circuit packaging system with external interconnect and method of manufacture thereof |
Arnel Senosa Trasporto, Linda Pei Ee Chua |
2016-04-26 |
| 9324584 |
Integrated circuit packaging system with transferable trace lead frame |
Arnel Senosa Trasporto, Linda Pei Ee Chua |
2016-04-26 |
| 9312194 |
Integrated circuit packaging system with terminals and method of manufacture thereof |
Arnel Senosa Trasporto, Linda Pei Ee Chua |
2016-04-12 |
| 9305873 |
Integrated circuit packaging system with electrical interface and method of manufacture thereof |
Arnel Senosa Trasporto, Linda Pei Ee Chua |
2016-04-05 |
| 9299644 |
Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof |
Arnel Senosa Trasporto, Zigmund Ramirez Camacho |
2016-03-29 |
| 9293385 |
RDL patterning with package on package system |
Reza A. Pagaila, Dioscoro A. Merilo |
2016-03-22 |
| 9293351 |
Integrated circuit packaging system with planarity control and method of manufacture thereof |
Arnel Senosa Trasporto, Linda Pei Ee Chua, Emmanuel Espiritu |
2016-03-22 |
| 9263361 |
Semiconductor device having a vertical interconnect structure using stud bumps |
Reza A. Pagaila, Shuangwu Huang, Rajendra D. Pendse |
2016-02-16 |
| 9236352 |
Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die |
Reza A. Pagaila, Shuangwu Huang, Nathapong Suthiwongsunthorn, Dioscoro A. Merilo |
2016-01-12 |