Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412624 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Jeffrey D. Punzalan, SeungYong Chai +3 more | 2016-08-09 |
| 9312150 | Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package | Nazir Ahmad, Young Do Kweon, Samuel Tam, Rajendra D. Pendse | 2016-04-12 |
| 9299650 | Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof | HeeJo Chi, HanGil Shin, NamJu Cho | 2016-03-29 |