Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412624 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Kyung-Moon Kim, SeungYong Chai +3 more | 2016-08-09 |
| 9355983 | Integrated circuit packaging system with interposer structure and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong | 2016-05-31 |
| 9305809 | Integrated circuit packaging system with coreless substrate and method of manufacture thereof | Emmanuel Espiritu, Allan P. Ilagan | 2016-04-05 |