Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412624 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Kyung-Moon Kim, Jeffrey D. Punzalan +3 more | 2016-08-09 |
| 9279673 | Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage | WonJun Ko, OhHan Kim, GwangTae Kim, Kenny Lee | 2016-03-08 |