Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502267 | Integrated circuit packaging system with support structure and method of manufacture thereof | HeeJo Chi, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Zigmund Ramirez Camacho | 2016-11-22 |
| 9412624 | Integrated circuit packaging system with substrate and method of manufacture thereof | Bartholomew Liao Chung Foh, Byung Tai Do, Kyung-Moon Kim, Jeffrey D. Punzalan, SeungYong Chai +3 more | 2016-08-09 |
| 9406531 | Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, HeeJo Chi | 2016-08-02 |
| 9406642 | Integrated circuit packaging system with insulated trace and method of manufacture thereof | HeeJo Chi, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Zigmund Ramirez Camacho | 2016-08-02 |
| 9355983 | Integrated circuit packaging system with interposer structure and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu, Bartholomew Liao Chung Foh, Jeffrey D. Punzalan | 2016-05-31 |
| 9331003 | Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, HeeJo Chi | 2016-05-03 |