Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9355983 | Integrated circuit packaging system with interposer structure and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan | 2016-05-31 |
| 9305809 | Integrated circuit packaging system with coreless substrate and method of manufacture thereof | Allan P. Ilagan, Jeffrey D. Punzalan | 2016-04-05 |
| 9293351 | Integrated circuit packaging system with planarity control and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua | 2016-03-22 |
| 9281300 | Chip scale module package in BGA semiconductor package | Leo A. Merilo, Dario S. Filoteo, Jr., Rachel Layda Abinan | 2016-03-08 |