Issued Patents 2016
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9525080 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device | Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2016-12-20 |
| 9502267 | Integrated circuit packaging system with support structure and method of manufacture thereof | HeeJo Chi, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong | 2016-11-22 |
| 9472427 | Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die | Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2016-10-18 |
| 9406642 | Integrated circuit packaging system with insulated trace and method of manufacture thereof | HeeJo Chi, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong | 2016-08-02 |
| 9406531 | Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof | Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi | 2016-08-02 |
| 9397236 | Optical semiconductor device having pre-molded leadframe with window and method therefor | Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2016-07-19 |
| 9390991 | Semiconductor device and method of forming wafer level ground plane and power ring | Guruprasad G. Badakere, Lionel Chien Hui Tay | 2016-07-12 |
| 9355983 | Integrated circuit packaging system with interposer structure and method of manufacture thereof | Emmanuel Espiritu, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan | 2016-05-31 |
| 9337161 | Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof | Dioscoro A. Merilo, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2016-05-10 |
| 9331003 | Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof | Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi | 2016-05-03 |
| 9330994 | Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring | Bartholomew Liao, Sheila Marie L. Alvarez, HeeJo Chi, Kelvin Dao | 2016-05-03 |
| 9324673 | Integrated circuit packaging system with wafer level reconfiguration and method of manufacture thereof | — | 2016-04-26 |
| 9299644 | Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2016-03-29 |
| 9257357 | Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die | Frederick R. Dahilig, Lionel Chien Hui Tay, Dioscoro A. Merilo | 2016-02-09 |
| 9252075 | Semiconductor device and method of forming a conductive via-in-via structure | Lionel Chien Hui Tay, Jianmin Fang | 2016-02-02 |