| 9525080 |
Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device |
Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto |
2016-12-20 |
| 9502267 |
Integrated circuit packaging system with support structure and method of manufacture thereof |
HeeJo Chi, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong |
2016-11-22 |
| 9472427 |
Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die |
Henry Descalzo Bathan, Jairus Legaspi Pisigan |
2016-10-18 |
| 9406642 |
Integrated circuit packaging system with insulated trace and method of manufacture thereof |
HeeJo Chi, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong |
2016-08-02 |
| 9406531 |
Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof |
Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi |
2016-08-02 |
| 9397236 |
Optical semiconductor device having pre-molded leadframe with window and method therefor |
Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto |
2016-07-19 |
| 9390991 |
Semiconductor device and method of forming wafer level ground plane and power ring |
Guruprasad G. Badakere, Lionel Chien Hui Tay |
2016-07-12 |
| 9355983 |
Integrated circuit packaging system with interposer structure and method of manufacture thereof |
Emmanuel Espiritu, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan |
2016-05-31 |
| 9337161 |
Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof |
Dioscoro A. Merilo, Henry Descalzo Bathan, Lionel Chien Hui Tay |
2016-05-10 |
| 9331003 |
Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof |
Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi |
2016-05-03 |
| 9330994 |
Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring |
Bartholomew Liao, Sheila Marie L. Alvarez, HeeJo Chi, Kelvin Dao |
2016-05-03 |
| 9324673 |
Integrated circuit packaging system with wafer level reconfiguration and method of manufacture thereof |
— |
2016-04-26 |
| 9299644 |
Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof |
Byung Tai Do, Arnel Senosa Trasporto |
2016-03-29 |
| 9257357 |
Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die |
Frederick R. Dahilig, Lionel Chien Hui Tay, Dioscoro A. Merilo |
2016-02-09 |
| 9252075 |
Semiconductor device and method of forming a conductive via-in-via structure |
Lionel Chien Hui Tay, Jianmin Fang |
2016-02-02 |