Issued Patents 2016
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9525080 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2016-12-20 |
| 9449932 | Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die | Byung Tai Do, Linda Pei Ee Chua, Reza A. Pagaila | 2016-09-20 |
| 9397236 | Optical semiconductor device having pre-molded leadframe with window and method therefor | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2016-07-19 |
| 9368423 | Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package | Byung Tai Do, Linda Pei Ee Chua, Asri Yusof | 2016-06-14 |
| 9324641 | Integrated circuit packaging system with external interconnect and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2016-04-26 |
| 9324584 | Integrated circuit packaging system with transferable trace lead frame | Byung Tai Do, Linda Pei Ee Chua | 2016-04-26 |
| 9312194 | Integrated circuit packaging system with terminals and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2016-04-12 |
| 9305873 | Integrated circuit packaging system with electrical interface and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2016-04-05 |
| 9299644 | Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof | Byung Tai Do, Zigmund Ramirez Camacho | 2016-03-29 |
| 9293351 | Integrated circuit packaging system with planarity control and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua, Emmanuel Espiritu | 2016-03-22 |