Issued Patents 2016
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530738 | Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant | Byung Tai Do, Reza A. Pagaila | 2016-12-27 |
| 9449932 | Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die | Byung Tai Do, Arnel Senosa Trasporto, Reza A. Pagaila | 2016-09-20 |
| 9443828 | Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation | Reza A. Pagaila, Byung Tai Do | 2016-09-13 |
| 9431331 | Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure | Byung Tai Do, Reza A. Pagaila | 2016-08-30 |
| 9368423 | Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package | Byung Tai Do, Arnel Senosa Trasporto, Asri Yusof | 2016-06-14 |
| 9331002 | Semiconductor device and method of forming through vias with reflowed conductive material | Reza A. Pagaila, Byung Tai Do | 2016-05-03 |
| 9324641 | Integrated circuit packaging system with external interconnect and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2016-04-26 |
| 9324584 | Integrated circuit packaging system with transferable trace lead frame | Byung Tai Do, Arnel Senosa Trasporto | 2016-04-26 |
| 9312194 | Integrated circuit packaging system with terminals and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2016-04-12 |
| 9305873 | Integrated circuit packaging system with electrical interface and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2016-04-05 |
| 9293351 | Integrated circuit packaging system with planarity control and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto, Emmanuel Espiritu | 2016-03-22 |