Issued Patents 2016
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530738 | Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant | Linda Pei Ee Chua, Byung Tai Do | 2016-12-27 |
| 9508626 | Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package height | Yaojian Lin | 2016-11-29 |
| 9484279 | Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die | Flynn Carson, Seung Uk Yoon | 2016-11-01 |
| 9449932 | Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die | Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua | 2016-09-20 |
| 9443828 | Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation | Byung Tai Do, Linda Pei Ee Chua | 2016-09-13 |
| 9443829 | Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure | — | 2016-09-13 |
| 9437538 | Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect | Yaojian Lin, Jun Mo Koo | 2016-09-06 |
| 9437482 | Semiconductor device and method of forming shielding layer over active surface of semiconductor die | — | 2016-09-06 |
| 9431331 | Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure | Byung Tai Do, Linda Pei Ee Chua | 2016-08-30 |
| 9431316 | Semiconductor device and method of forming channels in back surface of FO-WLCSP for heat dissipation | — | 2016-08-30 |
| 9418878 | Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP | Yaojian Lin | 2016-08-16 |
| 9418941 | Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP | Byung Tai Do | 2016-08-16 |
| 9418962 | Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers | — | 2016-08-16 |
| 9406619 | Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die | Byung Tai Do, Dioscoro A. Merilo | 2016-08-02 |
| 9343429 | Semiconductor device and method of forming double-sided through vias in saw streets | Byung Tai Do | 2016-05-17 |
| 9337116 | Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die | Yaojian Lin, Jun Mo Koo | 2016-05-10 |
| 9331002 | Semiconductor device and method of forming through vias with reflowed conductive material | Byung Tai Do, Linda Pei Ee Chua | 2016-05-03 |
| 9324672 | Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale package | — | 2016-04-26 |
| 9318441 | Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die | Yaojian Lin, Jun Mo Koo | 2016-04-19 |
| 9293385 | RDL patterning with package on package system | Byung Tai Do, Dioscoro A. Merilo | 2016-03-22 |
| 9263361 | Semiconductor device having a vertical interconnect structure using stud bumps | Byung Tai Do, Shuangwu Huang, Rajendra D. Pendse | 2016-02-16 |
| 9263301 | Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die | Yaojian Lin, Jun Mo Koo | 2016-02-16 |
| 9257411 | Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation | Yaojian Lin, JunMo Koo | 2016-02-09 |
| 9240380 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Seng Guan Chow, Seung Uk Yoon | 2016-01-19 |
| 9236332 | Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe | KiYoun Jang, HunTeak Lee | 2016-01-12 |