Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437538 | Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect | Reza A. Pagaila, Yaojian Lin | 2016-09-06 |
| 9337116 | Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die | Reza A. Pagaila, Yaojian Lin | 2016-05-10 |
| 9318441 | Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die | Reza A. Pagaila, Yaojian Lin | 2016-04-19 |
| 9305854 | Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package | Il Kwon Shim | 2016-04-05 |
| 9263301 | Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die | Reza A. Pagaila, Yaojian Lin | 2016-02-16 |