| 9515016 |
Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant |
Rui Huang, Seng Guan Chow, Heap Hoe Kuan |
2016-12-06 |
| 9508621 |
Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP |
Yaojian Lin, Seng Guan Chow |
2016-11-29 |
| 9331007 |
Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages |
InSang Yoon, Flynn Carson, SeongHun Mun |
2016-05-03 |
| 9305854 |
Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package |
Jun Mo Koo |
2016-04-05 |
| 9299648 |
Integrated circuit packaging system with patterned substrate and method of manufacture thereof |
Seng Guan Chow, Heap Hoe Kuan |
2016-03-29 |
| 9252066 |
Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer |
Yaojian Lin, Seng Guan Chow |
2016-02-02 |