Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515016 | Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant | Rui Huang, Seng Guan Chow, Heap Hoe Kuan | 2016-12-06 |
| 9508621 | Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP | Yaojian Lin, Seng Guan Chow | 2016-11-29 |
| 9331007 | Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages | InSang Yoon, Flynn Carson, SeongHun Mun | 2016-05-03 |
| 9305854 | Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package | Jun Mo Koo | 2016-04-05 |
| 9299648 | Integrated circuit packaging system with patterned substrate and method of manufacture thereof | Seng Guan Chow, Heap Hoe Kuan | 2016-03-29 |
| 9252066 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer | Yaojian Lin, Seng Guan Chow | 2016-02-02 |