Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484279 | Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die | Reza A. Pagaila, Seung Uk Yoon | 2016-11-01 |
| 9331007 | Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages | InSang Yoon, Il Kwon Shim, SeongHun Mun | 2016-05-03 |
| 9236319 | Stacked integrated circuit package system | Jong-Woo Ha, BumJoon Hong, Seongmin Lee | 2016-01-12 |