Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9355962 | Integrated circuit package stacking system with redistribution and method of manufacture thereof | Seongmin Lee, Sungmin Song | 2016-05-31 |
| 9330945 | Integrated circuit package system with multi-chip module | Sungmin Song, SeungYun Ahn, JoHyun Bae | 2016-05-03 |
| 9323845 | Portable communication terminal for extracting subjects of interest to the user, and a method therefor | Sang Keun Lee, Jung-hyun Lee | 2016-04-26 |
| 9236319 | Stacked integrated circuit package system | Flynn Carson, BumJoon Hong, Seongmin Lee | 2016-01-12 |
| 9230898 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | HanGil Shin, DeokKyung Yang | 2016-01-05 |