| 9508635 |
Methods of forming conductive jumper traces |
HeeJo Chi, NamJu Cho |
2016-11-29 |
| 9496152 |
Carrier system with multi-tier conductive posts and method of manufacture thereof |
NamJu Cho, HeeJo Chi |
2016-11-15 |
| 9406533 |
Methods of forming conductive and insulating layers |
HeeJo Chi, KyungMoon Kim |
2016-08-02 |
| 9397050 |
Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant |
HeeJo Chi, NamJu Cho |
2016-07-19 |
| 9362161 |
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package |
HeeJo Chi, NamJu Cho |
2016-06-07 |
| 9355939 |
Integrated circuit package stacking system with shielding and method of manufacture thereof |
NamJu Cho, HeeJo Chi |
2016-05-31 |
| 9312218 |
Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die |
DaeSik Choi, SooSan Park |
2016-04-12 |
| 9299650 |
Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof |
HeeJo Chi, NamJu Cho, Kyung-Moon Kim |
2016-03-29 |
| 9269691 |
Semiconductor device and method of making an embedded wafer level ball grid array (EWLB) package on package (POP) device with a slotted metal carrier interposer |
HeeJo Chi, NamJu Cho |
2016-02-23 |
| 9269595 |
Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint |
HeeJo Chi, NamJu Cho |
2016-02-23 |
| 9263332 |
Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP |
HeeJo Chi, NamJu Cho |
2016-02-16 |
| 9230898 |
Integrated circuit packaging system with package-on-package and method of manufacture thereof |
DeokKyung Yang, Jong-Woo Ha |
2016-01-05 |