Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9312218 | Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die | DaeSik Choi, HanGil Shin | 2016-04-12 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9312218 | Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die | DaeSik Choi, HanGil Shin | 2016-04-12 |