| 9530753 |
Integrated circuit packaging system with chip stacking and method of manufacture thereof |
Daesup Kim, Youngjoon KIM |
2016-12-27 |
| 9406579 |
Semiconductor device and method of controlling warpage in semiconductor package |
JoungIn Yang, Sang Mi Park, WonIl Kwon, YiSu Park |
2016-08-02 |
| 9401289 |
Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfaces |
Minjung Kim, KyungHoon Lee, JoungIn Yang, WonIl Kwon |
2016-07-26 |
| 9390945 |
Semiconductor device and method of depositing underfill material with uniform flow rate |
KyungHoon Lee, JoungIn Yang, Sang Mi Park, YiSu Park |
2016-07-12 |
| 9378983 |
Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material |
Sang Mi Park, KyungHoon Lee |
2016-06-28 |
| 9373578 |
Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties |
OhHan Kim, SungWon Cho |
2016-06-21 |
| 9349616 |
Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure |
KyungHoon Lee, HyunJin Song, Kyoungll Huh |
2016-05-24 |
| 9349666 |
Integrated circuit packaging system with package stacking |
JoHyun Bae, In Sang Yoon |
2016-05-24 |
| 9324659 |
Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die |
SungWon Cho, HyungSang Park, DongSoo Moon |
2016-04-26 |
| 9312218 |
Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die |
SooSan Park, HanGil Shin |
2016-04-12 |
| 9305897 |
Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate |
Jongho Kim, HyungMin Lee |
2016-04-05 |
| 9281228 |
Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die |
JoungIn Yang, Minjung Kim, Sang Mi Park, MinWook Yu |
2016-03-08 |
| 9252093 |
Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer |
JoonYoung Choi, Wonll Kwon |
2016-02-02 |
| 9252094 |
Semiconductor device and method of forming an interconnect structure with conductive material recessed within conductive ring over surface of conductive pillar |
Sang Mi Park |
2016-02-02 |
| 9252032 |
Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias |
WonJun Ko, JaEun Yun |
2016-02-02 |