| 9478486 |
Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV |
Sun Mi Kim, OhHan Kim |
2016-10-25 |
| 9460972 |
Semiconductor device and method of forming reduced surface roughness in molded underfill for improved C-SAM inspection |
SeongWon Park, KiYoun Jang, Jaehyun Lee |
2016-10-04 |
| 9401289 |
Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfaces |
Minjung Kim, JoungIn Yang, WonIl Kwon, DaeSik Choi |
2016-07-26 |
| 9390945 |
Semiconductor device and method of depositing underfill material with uniform flow rate |
JoungIn Yang, Sang Mi Park, DaeSik Choi, YiSu Park |
2016-07-12 |
| 9378983 |
Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material |
DaeSik Choi, Sang Mi Park |
2016-06-28 |
| 9349616 |
Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure |
HyunJin Song, Kyoungll Huh, DaeSik Choi |
2016-05-24 |
| 9293349 |
Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield |
OhHan Kim, Sunmi Kim |
2016-03-22 |
| 9230933 |
Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure |
Jaehyun Lee, SeongWon Park, KiYoun Jang |
2016-01-05 |