SK

Sunmi Kim

SC Stats Chippac: 1 patents #56 of 121Top 50%
Overall (2016): #216,264 of 481,213Top 45%
1
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9293349 Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield OhHan Kim, KyungHoon Lee 2016-03-22