Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349616 | Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure | KyungHoon Lee, HyunJin Song, DaeSik Choi | 2016-05-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349616 | Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure | KyungHoon Lee, HyunJin Song, DaeSik Choi | 2016-05-24 |