Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9460972 | Semiconductor device and method of forming reduced surface roughness in molded underfill for improved C-SAM inspection | SeongWon Park, KiYoun Jang, KyungHoon Lee | 2016-10-04 |
| 9242686 | Joint guarantee system for vehicle assembly and control method of the same | — | 2016-01-26 |
| 9230933 | Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure | KyungHoon Lee, SeongWon Park, KiYoun Jang | 2016-01-05 |