Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9460972 | Semiconductor device and method of forming reduced surface roughness in molded underfill for improved C-SAM inspection | KiYoun Jang, KyungHoon Lee, Jaehyun Lee | 2016-10-04 |
| 9230933 | Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure | Jaehyun Lee, KyungHoon Lee, KiYoun Jang | 2016-01-05 |