Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9460972 | Semiconductor device and method of forming reduced surface roughness in molded underfill for improved C-SAM inspection | SeongWon Park, KyungHoon Lee, Jaehyun Lee | 2016-10-04 |
| 9236332 | Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe | Reza A. Pagaila, HunTeak Lee | 2016-01-12 |
| 9230933 | Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure | Jaehyun Lee, KyungHoon Lee, SeongWon Park | 2016-01-05 |