Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406579 | Semiconductor device and method of controlling warpage in semiconductor package | DaeSik Choi, JoungIn Yang, Sang Mi Park, YiSu Park | 2016-08-02 |
| 9401289 | Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfaces | Minjung Kim, KyungHoon Lee, JoungIn Yang, DaeSik Choi | 2016-07-26 |