Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9391046 | Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer | Yeonglm Park, HeeJo Chi | 2016-07-12 |
| 9305897 | Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate | DaeSik Choi, Jongho Kim | 2016-04-05 |