Issued Patents 2016
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508635 | Methods of forming conductive jumper traces | HanGil Shin, NamJu Cho | 2016-11-29 |
| 9502267 | Integrated circuit packaging system with support structure and method of manufacture thereof | Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong | 2016-11-22 |
| 9496152 | Carrier system with multi-tier conductive posts and method of manufacture thereof | NamJu Cho, HanGil Shin | 2016-11-15 |
| 9406531 | Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong | 2016-08-02 |
| 9406642 | Integrated circuit packaging system with insulated trace and method of manufacture thereof | Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong | 2016-08-02 |
| 9406533 | Methods of forming conductive and insulating layers | HanGil Shin, KyungMoon Kim | 2016-08-02 |
| 9397050 | Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant | HanGil Shin, NamJu Cho | 2016-07-19 |
| 9391046 | Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer | Yeonglm Park, HyungMin Lee | 2016-07-12 |
| 9385100 | Integrated circuit packaging system with surface treatment and method of manufacture thereof | Hun Teak Lee, YoungChul Kim, Hyunll Bae, HeeSoo Lee | 2016-07-05 |
| 9362161 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HanGil Shin, NamJu Cho | 2016-06-07 |
| 9355939 | Integrated circuit package stacking system with shielding and method of manufacture thereof | NamJu Cho, HanGil Shin | 2016-05-31 |
| 9331003 | Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong | 2016-05-03 |
| 9330994 | Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring | Zigmund Ramirez Camacho, Bartholomew Liao, Sheila Marie L. Alvarez, Kelvin Dao | 2016-05-03 |
| 9299650 | Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof | HanGil Shin, NamJu Cho, Kyung-Moon Kim | 2016-03-29 |
| 9287204 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more | 2016-03-15 |
| 9269595 | Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint | NamJu Cho, HanGil Shin | 2016-02-23 |
| 9269691 | Semiconductor device and method of making an embedded wafer level ball grid array (EWLB) package on package (POP) device with a slotted metal carrier interposer | HanGil Shin, NamJu Cho | 2016-02-23 |
| 9263332 | Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP | NamJu Cho, HanGil Shin | 2016-02-16 |
| 9252130 | Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding | KyungMoon Kim, YoungChul Kim, HunTeak Lee, KeonTaek Kang | 2016-02-02 |
| 9245770 | Semiconductor device and method of simultaneous molding and thermalcompression bonding | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +2 more | 2016-01-26 |
| 9240331 | Semiconductor device and method of making bumpless flipchip interconnect structures | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more | 2016-01-19 |