| 9508635 |
Methods of forming conductive jumper traces |
HanGil Shin, NamJu Cho |
2016-11-29 |
| 9502267 |
Integrated circuit packaging system with support structure and method of manufacture thereof |
Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong |
2016-11-22 |
| 9496152 |
Carrier system with multi-tier conductive posts and method of manufacture thereof |
NamJu Cho, HanGil Shin |
2016-11-15 |
| 9406531 |
Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof |
Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong |
2016-08-02 |
| 9406642 |
Integrated circuit packaging system with insulated trace and method of manufacture thereof |
Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong |
2016-08-02 |
| 9406533 |
Methods of forming conductive and insulating layers |
HanGil Shin, KyungMoon Kim |
2016-08-02 |
| 9397050 |
Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant |
HanGil Shin, NamJu Cho |
2016-07-19 |
| 9391046 |
Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer |
Yeonglm Park, HyungMin Lee |
2016-07-12 |
| 9385100 |
Integrated circuit packaging system with surface treatment and method of manufacture thereof |
Hun Teak Lee, YoungChul Kim, Hyunll Bae, HeeSoo Lee |
2016-07-05 |
| 9362161 |
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package |
HanGil Shin, NamJu Cho |
2016-06-07 |
| 9355939 |
Integrated circuit package stacking system with shielding and method of manufacture thereof |
NamJu Cho, HanGil Shin |
2016-05-31 |
| 9331003 |
Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof |
Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong |
2016-05-03 |
| 9330994 |
Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring |
Zigmund Ramirez Camacho, Bartholomew Liao, Sheila Marie L. Alvarez, Kelvin Dao |
2016-05-03 |
| 9299650 |
Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof |
HanGil Shin, NamJu Cho, Kyung-Moon Kim |
2016-03-29 |
| 9287204 |
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form |
KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more |
2016-03-15 |
| 9269595 |
Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint |
NamJu Cho, HanGil Shin |
2016-02-23 |
| 9269691 |
Semiconductor device and method of making an embedded wafer level ball grid array (EWLB) package on package (POP) device with a slotted metal carrier interposer |
HanGil Shin, NamJu Cho |
2016-02-23 |
| 9263332 |
Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP |
NamJu Cho, HanGil Shin |
2016-02-16 |
| 9252130 |
Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding |
KyungMoon Kim, YoungChul Kim, HunTeak Lee, KeonTaek Kang |
2016-02-02 |
| 9245770 |
Semiconductor device and method of simultaneous molding and thermalcompression bonding |
KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +2 more |
2016-01-26 |
| 9240331 |
Semiconductor device and method of making bumpless flipchip interconnect structures |
KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more |
2016-01-19 |