Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524958 | Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding | JoonYoung Choi, YongHee Kang, HunTeak Lee, KeonTaek Kang | 2016-12-20 |
| 9385100 | Integrated circuit packaging system with surface treatment and method of manufacture thereof | Hun Teak Lee, Hyunll Bae, HeeSoo Lee, HeeJo Chi | 2016-07-05 |
| 9287204 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, KooHong Lee, JaeHak Yee, Lan H. Hoang, Pandi C. Marimuthu +3 more | 2016-03-15 |
| 9252130 | Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding | KyungMoon Kim, HunTeak Lee, KeonTaek Kang, HeeJo Chi | 2016-02-02 |
| 9245772 | Stackable package by using internal stacking modules | JoungIn Yang, Choongbin Yim, KeonTeak Kang | 2016-01-26 |
| 9245770 | Semiconductor device and method of simultaneous molding and thermalcompression bonding | KyungMoon Kim, KooHong Lee, JaeHak Yee, Lan H. Hoang, Pandi C. Marimuthu +2 more | 2016-01-26 |
| 9240331 | Semiconductor device and method of making bumpless flipchip interconnect structures | KyungMoon Kim, KooHong Lee, JaeHak Yee, Lan H. Hoang, Pandi C. Marimuthu +3 more | 2016-01-19 |