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Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding |
JoonYoung Choi, YongHee Kang, HunTeak Lee, KeonTaek Kang |
2016-12-20 |
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Integrated circuit packaging system with surface treatment and method of manufacture thereof |
Hun Teak Lee, Hyunll Bae, HeeSoo Lee, HeeJo Chi |
2016-07-05 |
| 9287204 |
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form |
KyungMoon Kim, KooHong Lee, JaeHak Yee, Lan H. Hoang, Pandi C. Marimuthu +3 more |
2016-03-15 |
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Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding |
KyungMoon Kim, HunTeak Lee, KeonTaek Kang, HeeJo Chi |
2016-02-02 |
| 9245772 |
Stackable package by using internal stacking modules |
JoungIn Yang, Choongbin Yim, KeonTeak Kang |
2016-01-26 |
| 9245770 |
Semiconductor device and method of simultaneous molding and thermalcompression bonding |
KyungMoon Kim, KooHong Lee, JaeHak Yee, Lan H. Hoang, Pandi C. Marimuthu +2 more |
2016-01-26 |
| 9240331 |
Semiconductor device and method of making bumpless flipchip interconnect structures |
KyungMoon Kim, KooHong Lee, JaeHak Yee, Lan H. Hoang, Pandi C. Marimuthu +3 more |
2016-01-19 |