CY

Choongbin Yim

SC Stats Chippac: 1 patents #56 of 121Top 50%
Samsung: 1 patents #6,237 of 13,934Top 45%
📍 Seoul, KR: #1,651 of 7,292 inventorsTop 25%
Overall (2016): #151,725 of 481,213Top 35%
2
Patents 2016

Issued Patents 2016

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9245772 Stackable package by using internal stacking modules JoungIn Yang, KeonTeak Kang, YoungChul Kim 2016-01-26
9245867 Package-on-package electronic devices including sealing layers and related methods of forming the same Hae-Jung Yu, Taesung Park 2016-01-26