Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9245863 | Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heights | Hak-Kyoon Byun, Kyung-Tae Na, Seung Hun Han, Tae-Sung Park, Choong Bin Yim | 2016-01-26 |
| 9245867 | Package-on-package electronic devices including sealing layers and related methods of forming the same | Choongbin Yim, Taesung Park | 2016-01-26 |