Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9245863 | Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heights | Hae-Jung Yu, Kyung-Tae Na, Seung Hun Han, Tae-Sung Park, Choong Bin Yim | 2016-01-26 |