Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524958 | Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding | YongHee Kang, HunTeak Lee, KeonTaek Kang, YoungChul Kim | 2016-12-20 |
| 9252093 | Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer | DaeSik Choi, Wonll Kwon | 2016-02-02 |