Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524958 | Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding | JoonYoung Choi, YongHee Kang, HunTeak Lee, YoungChul Kim | 2016-12-20 |
| 9252130 | Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding | KyungMoon Kim, YoungChul Kim, HunTeak Lee, HeeJo Chi | 2016-02-02 |