WK

Wonll Kwon

SC Stats Chippac: 1 patents #56 of 121Top 50%
Overall (2016): #183,477 of 481,213Top 40%
1
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9252093 Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer DaeSik Choi, JoonYoung Choi 2016-02-02