| 9496195 |
Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP |
Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon |
2016-11-15 |
| 9443797 |
Semiconductor device having wire studs as vertical interconnect in FO-WLP |
Sheila Marie L. Alvarez, Yaojian Lin, Jose Alvin Caparas, Yang Tan |
2016-09-13 |
| 9443762 |
Semiconductor device and method of forming a thin wafer without a carrier |
Shuangwu Huang, Nathapong Suthiwongsunthorn |
2016-09-13 |
| 9355993 |
Integrated circuit system with debonding adhesive and method of manufacture thereof |
Won Kyoung Choi |
2016-05-31 |
| 9343396 |
Semiconductor device and method of forming IPD in fan-out wafer level chip scale package |
Yaojian Lin, Robert C. Frye, Kai Liu |
2016-05-17 |
| 9318404 |
Semiconductor device and method of forming stress relieving vias for improved fan-out WLCSP package |
Yaojian Lin, Kang Chen, Yu Gu |
2016-04-19 |
| 9293401 |
Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) |
Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Kang Chen, Xusheng Bao +1 more |
2016-03-22 |
| 9287204 |
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form |
KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more |
2016-03-15 |
| 9245770 |
Semiconductor device and method of simultaneous molding and thermalcompression bonding |
KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +2 more |
2016-01-26 |
| 9240331 |
Semiconductor device and method of making bumpless flipchip interconnect structures |
KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more |
2016-01-19 |