Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520365 | Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers | Yaojian Lin, Kang Chen, Wei Meng, Chee Siang Ong | 2016-12-13 |
| 9385102 | Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package | Yaojian Lin, Kang Chen | 2016-07-05 |
| 9318404 | Semiconductor device and method of forming stress relieving vias for improved fan-out WLCSP package | Yaojian Lin, Pandi C. Marimuthu, Kang Chen | 2016-04-19 |
| 9252092 | Semiconductor device and method of forming through mold hole with alignment and dimension control | Yaojian Lin, Kang Chen | 2016-02-02 |