Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520365 | Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers | Yaojian Lin, Kang Chen, Yu Gu, Chee Siang Ong | 2016-12-13 |
| 9472562 | Semiconductor device and method for fabricating the same | Qiu-Ji Zhao, Ling Wu, Zhi-Hui Jiao, Zhi Li, Chi Ren | 2016-10-18 |
| 9348860 | Method for encoding a mesh model, encoded mesh model and method for decoding a mesh model | Kangying Cai, Jiang Tian | 2016-05-24 |