| 9527723 |
Semiconductor device and method of forming microelectromechanical systems (MEMS) package |
Yaojian Lin, Won Kyoung Choi, Ivan Micallef |
2016-12-27 |
| 9520365 |
Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers |
Yaojian Lin, Yu Gu, Wei Meng, Chee Siang Ong |
2016-12-13 |
| 9484259 |
Semiconductor device and method of forming protection and support structure for conductive interconnect structure |
Yaojian Lin, Jianmin Fang |
2016-11-01 |
| 9472452 |
Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die |
Yaojian Lin, Jianmin Fang, Xia Feng |
2016-10-18 |
| 9449943 |
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern |
Yaojian Lin, Hin Hwa Goh, II Kwon Shim |
2016-09-20 |
| 9449925 |
Integrated passive devices |
Yaojian Lin, Haijing Cao, Qing Zhang, Jianmin Fang |
2016-09-20 |
| 9437552 |
Semiconductor device and method of forming insulating layer around semiconductor die |
Yaojian Lin, Jianmin Fang, Xia Feng, Xusheng Bao |
2016-09-06 |
| 9401331 |
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP |
Yaojian Lin, Xusheng Bao, Jianmin Fang |
2016-07-26 |
| 9385052 |
Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages |
Yaojian Lin |
2016-07-05 |
| 9385006 |
Semiconductor device and method of forming an embedded SOP fan-out package |
Yaojian Lin |
2016-07-05 |
| 9385102 |
Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package |
Yaojian Lin, Yu Gu |
2016-07-05 |
| 9368563 |
Semiconductor device including integrated passive device formed over semiconductor die with conductive bridge and fan-out redistribution layer |
Yaojian Lin, Kai Liu |
2016-06-14 |
| 9324700 |
Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels |
Yaojian Lin, Jianmin Fang, Haijing Cao |
2016-04-26 |
| 9318404 |
Semiconductor device and method of forming stress relieving vias for improved fan-out WLCSP package |
Yaojian Lin, Pandi C. Marimuthu, Yu Gu |
2016-04-19 |
| 9293401 |
Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) |
Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Xusheng Bao +1 more |
2016-03-22 |
| 9281259 |
Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in FO-WLCSP |
Yaojian Lin, Jose Alvin Caparas, Glenn Omandam |
2016-03-08 |
| 9269598 |
Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit |
Yaojian Lin, Jianmin Fang, Haijing Cao |
2016-02-23 |
| 9252092 |
Semiconductor device and method of forming through mold hole with alignment and dimension control |
Yaojian Lin, Yu Gu |
2016-02-02 |
| 9236278 |
Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof |
Rui Huang, Xusheng Bao, Yung Kuan Hsiao, Hin Hwa Goh |
2016-01-12 |