Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9236278 | Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof | Rui Huang, Xusheng Bao, Kang Chen, Hin Hwa Goh | 2016-01-12 |