Issued Patents 2016
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9522949 | Fusion protein for antagonizing angiogenesis inducible factors and uses thereof | Dong Li | 2016-12-20 |
| 9484259 | Semiconductor device and method of forming protection and support structure for conductive interconnect structure | Yaojian Lin, Kang Chen | 2016-11-01 |
| 9472452 | Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die | Yaojian Lin, Kang Chen, Xia Feng | 2016-10-18 |
| 9449925 | Integrated passive devices | Yaojian Lin, Haijing Cao, Qing Zhang, Kang Chen | 2016-09-20 |
| 9451493 | Drive test minimization method and device for obtaining time delay | Dapeng Li, Lifeng Han, Zijiang Ma, He Huang, Feng He | 2016-09-20 |
| 9437552 | Semiconductor device and method of forming insulating layer around semiconductor die | Yaojian Lin, Kang Chen, Xia Feng, Xusheng Bao | 2016-09-06 |
| 9401331 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Xusheng Bao, Kang Chen | 2016-07-26 |
| 9324700 | Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels | Yaojian Lin, Kang Chen, Haijing Cao | 2016-04-26 |
| 9293401 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) | Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Kang Chen +1 more | 2016-03-22 |
| 9273137 | FGFR-Fc fusion proteins and the use thereof | Dong Li | 2016-03-01 |
| 9269598 | Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit | Yaojian Lin, Kang Chen, Haijing Cao | 2016-02-23 |
| 9252075 | Semiconductor device and method of forming a conductive via-in-via structure | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2016-02-02 |