Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496195 | Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Heinz-Peter Wirtz, Pandi C. Marimuthu | 2016-11-15 |
| 9293401 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) | Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Xusheng Bao +1 more | 2016-03-22 |