Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496195 | Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Seung Wook Yoon, Pandi C. Marimuthu | 2016-11-15 |