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Clock generator, communication device and sequential clock gating circuit |
Chih-Jung Chiang, Shun-Te Tseng, Jian-Ru Lin |
2016-11-22 |
| 9484334 |
Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing |
Robert C. Frye |
2016-11-01 |
| 9443815 |
Embedded die redistribution layers for active device |
Kumar Nagarajan, Satbir Madra |
2016-09-13 |
| 9412684 |
Top exposed semiconductor chip package |
Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Anup Bhalla, Jun Lu |
2016-08-09 |
| 9368563 |
Semiconductor device including integrated passive device formed over semiconductor die with conductive bridge and fan-out redistribution layer |
Yaojian Lin, Kang Chen |
2016-06-14 |
| 9343396 |
Semiconductor device and method of forming IPD in fan-out wafer level chip scale package |
Yaojian Lin, Robert C. Frye, Pandi C. Marimuthu |
2016-05-17 |
| 9337132 |
Methods and configuration for manufacturing flip chip contact (FCC) power package |
Ming Sun, Xiaotian Zhang, Yueh-Se Ho, Leeshawn Luo |
2016-05-10 |
| 9318671 |
High efficiency light emitting diode package suitable for wafer level packaging |
Chao-Kun Lin |
2016-04-19 |