Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9501088 | Clock generator, communication device and sequential clock gating circuit | Chih-Jung Chiang, Shun-Te Tseng, Jian-Ru Lin | 2016-11-22 |
| 9484334 | Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing | Robert C. Frye | 2016-11-01 |
| 9443815 | Embedded die redistribution layers for active device | Kumar Nagarajan, Satbir Madra | 2016-09-13 |
| 9412684 | Top exposed semiconductor chip package | Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Anup Bhalla, Jun Lu | 2016-08-09 |
| 9368563 | Semiconductor device including integrated passive device formed over semiconductor die with conductive bridge and fan-out redistribution layer | Yaojian Lin, Kang Chen | 2016-06-14 |
| 9343396 | Semiconductor device and method of forming IPD in fan-out wafer level chip scale package | Yaojian Lin, Robert C. Frye, Pandi C. Marimuthu | 2016-05-17 |
| 9337132 | Methods and configuration for manufacturing flip chip contact (FCC) power package | Ming Sun, Xiaotian Zhang, Yueh-Se Ho, Leeshawn Luo | 2016-05-10 |
| 9318671 | High efficiency light emitting diode package suitable for wafer level packaging | Chao-Kun Lin | 2016-04-19 |