Issued Patents 2016
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520380 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Hamza Yilmaz, Jun Lu, Zhiqiang Niu, Guo Feng Lian | 2016-12-13 |
| 9478646 | Methods for fabricating anode shorted field stop insulated gate bipolar transistor | Anup Bhalla, Madhur Bobde, Yongping Ding, Xiaotian Zhang | 2016-10-25 |
| 9472491 | Semiconductor package with small gate clip and assembly method | Yan Xun Xue, Hamza Yilmaz, Jun Lu, Ming-Chen Lu, Hongtao Gao | 2016-10-18 |
| 9437530 | Combined packaged power semiconductor device | Hamza Yilmaz, Yan Yun Xue, Jun Lu | 2016-09-06 |
| 9412684 | Top exposed semiconductor chip package | Yan Xun Xue, Hamza Yilmaz, Anup Bhalla, Jun Lu, Kai Liu | 2016-08-09 |
| 9406661 | Protection circuit including vertical gallium nitride schottky diode and PN junction diode | TingGang Zhu, Anup Bhalla, Ping Huang | 2016-08-02 |
| 9397029 | Power semiconductor package device having locking mechanism, and preparation method thereof | Yan Xun Xue, Hamza Yilmaz, Jun Lu, De Mei Gong | 2016-07-19 |
| 9391005 | Method for packaging a power device with bottom source electrode | Yan Xun Xue, Hamza Yilmaz, Jun Lu, Lei Shi, Liang Zhao +1 more | 2016-07-12 |
| 9337132 | Methods and configuration for manufacturing flip chip contact (FCC) power package | Ming Sun, Kai Liu, Xiaotian Zhang, Leeshawn Luo | 2016-05-10 |
| 9305870 | Power semiconductor device and preparation method thereof | Yan Xun Xue, Hamza Yilmaz, Jun Lu | 2016-04-05 |
| 9281265 | Packaging structure of a semiconductor device | Yan Xun Xue, Jun Lu, Lei Shi, Liang Zhao, Ping Huang | 2016-03-08 |
| 9269699 | Embedded package and method thereof | Zhiqiang Niu, Hua Pan, Ming-Chen Lu, Jun Lu | 2016-02-23 |
| 9245861 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Hamza Yilmaz, Jun Lu, Zhiqiang Niu, Guo Feng Lian +2 more | 2016-01-26 |