Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520380 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Guo Feng Lian | 2016-12-13 |
| 9425181 | Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter H. Wilson, Yan Huo +1 more | 2016-08-23 |
| 9318424 | MCSP power semiconductor devices and preparation methods thereof | Jun Lu, Hamza Yilmaz, Hongtao Gao | 2016-04-19 |
| 9269699 | Embedded package and method thereof | Hua Pan, Ming-Chen Lu, Yueh-Se Ho, Jun Lu | 2016-02-23 |
| 9245861 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Guo Feng Lian +2 more | 2016-01-26 |