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Semiconductor package with small gate clip and assembly method |
Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Hongtao Gao |
2016-10-18 |
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Flip chip semiconductor device |
Xiaotian Zhang, Hamza Yilmaz, Jun Lu, Xiaoguang Zeng |
2016-09-06 |
| 9425181 |
Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures |
Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter H. Wilson, Yan Huo +1 more |
2016-08-23 |
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Power semiconductor device and the preparation method |
Yan Huo, Hamza Yilmaz, Jun Lu, Zhi Qiang Niu, Yan Xun Xue +1 more |
2016-05-10 |
| 9318396 |
Method of fabricating flash memory |
Chia-Ming Wu |
2016-04-19 |
| 9269699 |
Embedded package and method thereof |
Zhiqiang Niu, Hua Pan, Yueh-Se Ho, Jun Lu |
2016-02-23 |
| 9245831 |
Top-exposed semiconductor package and the manufacturing method |
Yan Huo, Zhi Qiang Niu, Hongtao Gao |
2016-01-26 |
| 9230949 |
Method of making stacked multi-chip packaging structure |
Xiaotian Zhang, Hua Pan, Jun Lu, Hamza Yilmaz |
2016-01-05 |