Issued Patents 2016
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530885 | Normally on high voltage switch | Madhur Bobde, Daniel Calafut, Karthik Padmanabhan | 2016-12-27 |
| 9520464 | Configuration and method to generate saddle junction electric field in edge termination | Madhur Bobde, Lingpeng Guan, Anup Bhalla | 2016-12-13 |
| 9520380 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Yueh-Se Ho, Jun Lu, Zhiqiang Niu, Guo Feng Lian | 2016-12-13 |
| 9508805 | Termination design for nanotube MOSFET | Lingpeng Guan, Madhur Bobde, Karthik Padmanabhan | 2016-11-29 |
| 9502503 | Nanotube semiconductor devices | Xiaobin Wang, Anup Bhalla, John Chen, Hong Chang | 2016-11-22 |
| 9502554 | High frequency switching MOSFETs with low output capacitance using a depletable P-shield | Madhur Bobde, Sik Lui, Daniel Ng | 2016-11-22 |
| 9484452 | Integrating enhancement mode depleted accumulation/inversion channel devices with MOSFETs | Madhur Bobde, Sik Lui, Jongoh Kim, Daniel Ng | 2016-11-01 |
| 9484453 | Device structure and methods of making high density MOSFETs for load switch and DC-DC applications | Madhur Bobde, Hong Chang, Yeeheng Lee, Daniel Calafut, Jongoh Kim +2 more | 2016-11-01 |
| 9472491 | Semiconductor package with small gate clip and assembly method | Yan Xun Xue, Yueh-Se Ho, Jun Lu, Ming-Chen Lu, Hongtao Gao | 2016-10-18 |
| 9450050 | Lateral super junctions with high substrate breakdown and build in avalanche clamp diode | Madhur Bobde, Anup Bhalla, Wilson Ma, Lingping Guan, Yeeheng Lee +1 more | 2016-09-20 |
| 9450088 | High density trench-based power MOSFETs with self-aligned active contacts and method for making such devices | Yeeheng Lee, Hong Chang, Jongoh Kim, Sik Lui, Madhur Bobde +2 more | 2016-09-20 |
| 9450083 | High voltage field balance metal oxide field effect transistor (FBM) | Anup Bhalla, Madhur Bobde, Lingpeng Guan, Jun Hu, Jongoh Kim +1 more | 2016-09-20 |
| 9450045 | Method for forming lateral super-junction structure | Madhur Bobde, Lingpeng Guan, Karthik Padmanabhan | 2016-09-20 |
| 9437530 | Combined packaged power semiconductor device | Yueh-Se Ho, Yan Yun Xue, Jun Lu | 2016-09-06 |
| 9437587 | Flip chip semiconductor device | Xiaotian Zhang, Jun Lu, Xiaoguang Zeng, Ming-Chen Lu | 2016-09-06 |
| 9431328 | Power device and preparation method thereof | Yan Xun Xue, Jun Lu | 2016-08-30 |
| 9425181 | Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures | Yan Xun Xue, Jun Lu, Peter H. Wilson, Yan Huo, Zhiqiang Niu +1 more | 2016-08-23 |
| 9412684 | Top exposed semiconductor chip package | Yan Xun Xue, Yueh-Se Ho, Anup Bhalla, Jun Lu, Kai Liu | 2016-08-09 |
| 9397029 | Power semiconductor package device having locking mechanism, and preparation method thereof | Yan Xun Xue, Yueh-Se Ho, Jun Lu, De Mei Gong | 2016-07-19 |
| 9391005 | Method for packaging a power device with bottom source electrode | Yan Xun Xue, Yueh-Se Ho, Jun Lu, Lei Shi, Liang Zhao +1 more | 2016-07-12 |
| 9356022 | Semiconductor device with termination structure for power MOSFET applications | Yeeheng Lee, Madhur Bobde, Daniel Calafut, Xiaobin Wang, Ji Pan +2 more | 2016-05-31 |
| 9349796 | Nanotube semiconductor devices | Xiaobin Wang, Anup Bhalla, John Chen, Hong Chang | 2016-05-24 |
| 9337131 | Power semiconductor device and the preparation method | Yan Huo, Jun Lu, Ming-Chen Lu, Zhi Qiang Niu, Yan Xun Xue +1 more | 2016-05-10 |
| 9318587 | Injection control in semiconductor power devices | Madhur Bobde, Jun Hu, Lingpeng Guan, Lei Zhang, Jongoh Kim | 2016-04-19 |
| 9318424 | MCSP power semiconductor devices and preparation methods thereof | Zhiqiang Niu, Jun Lu, Hongtao Gao | 2016-04-19 |