Issued Patents 2016
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9312381 | Lateral super-junction MOSFET device and termination structure | Madhur Bobde, Lingpeng Guan, Karthik Padmanabhan | 2016-04-12 |
| 9305870 | Power semiconductor device and preparation method thereof | Yan Xun Xue, Yueh-Se Ho, Jun Lu | 2016-04-05 |
| 9293397 | Power device and preparation method thereof | Yan Xun Xue, Jun Lu | 2016-03-22 |
| 9281394 | Nano MOSFET with trench bottom oxide shielded and third dimensional P-body contact | Daniel Ng, Daniel Calafut, Madhur Bobde, Anup Bhalla, Ji Pan +2 more | 2016-03-08 |
| 9281416 | Trench MOSFET with integrated Schottky barrier diode | Daniel Calafut, Yi Su, Jongoh Kim, Hong Chang, Daniel Ng | 2016-03-08 |
| 9281368 | Split-gate trench power MOSFET with protected shield oxide | Yeeheng Lee, Lingpeng Guan, Hongyong Xue, Yiming Gu, Yang Xiang +6 more | 2016-03-08 |
| 9252264 | High frequency switching MOSFETs with low output capacitance using a depletable P-shield | Madhur Bobde, Sik Lui, Daniel Ng | 2016-02-02 |
| 9252239 | Semiconductor power devices manufactured with self-aligned processes and more reliable electrical contacts | John Chen, Daniel Ng, Wenjun Li | 2016-02-02 |
| 9245949 | Nanotube semiconductor devices | Xiaobin Wang, Anup Bhalla, John Chen, Hong Chang | 2016-01-26 |
| 9245861 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Yueh-Se Ho, Jun Lu, Zhiqiang Niu, Guo Feng Lian +2 more | 2016-01-26 |
| 9231050 | Configuration and method to generate saddle junction electric field in edge termination | Madhur Bobde, Lingping Guan, Anup Bhalla | 2016-01-05 |
| 9230949 | Method of making stacked multi-chip packaging structure | Xiaotian Zhang, Hua Pan, Ming-Chen Lu, Jun Lu | 2016-01-05 |