Issued Patents 2016
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520380 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Zhiqiang Niu, Guo Feng Lian | 2016-12-13 |
| 9502268 | Method and structure for wafer level packaging with large contact area | — | 2016-11-22 |
| 9472491 | Semiconductor package with small gate clip and assembly method | Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Ming-Chen Lu, Hongtao Gao | 2016-10-18 |
| 9431328 | Power device and preparation method thereof | Hamza Yilmaz, Jun Lu | 2016-08-30 |
| 9425181 | Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Jun Lu, Peter H. Wilson, Yan Huo, Zhiqiang Niu +1 more | 2016-08-23 |
| 9412684 | Top exposed semiconductor chip package | Yueh-Se Ho, Hamza Yilmaz, Anup Bhalla, Jun Lu, Kai Liu | 2016-08-09 |
| 9397029 | Power semiconductor package device having locking mechanism, and preparation method thereof | Hamza Yilmaz, Yueh-Se Ho, Jun Lu, De Mei Gong | 2016-07-19 |
| 9391005 | Method for packaging a power device with bottom source electrode | Yueh-Se Ho, Hamza Yilmaz, Jun Lu, Lei Shi, Liang Zhao +1 more | 2016-07-12 |
| 9337131 | Power semiconductor device and the preparation method | Yan Huo, Hamza Yilmaz, Jun Lu, Ming-Chen Lu, Zhi Qiang Niu +1 more | 2016-05-10 |
| 9305870 | Power semiconductor device and preparation method thereof | Hamza Yilmaz, Yueh-Se Ho, Jun Lu | 2016-04-05 |
| 9293397 | Power device and preparation method thereof | Hamza Yilmaz, Jun Lu | 2016-03-22 |
| 9281265 | Packaging structure of a semiconductor device | Yueh-Se Ho, Jun Lu, Lei Shi, Liang Zhao, Ping Huang | 2016-03-08 |
| 9245861 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Zhiqiang Niu, Guo Feng Lian +2 more | 2016-01-26 |