| 9520380 |
Wafer process for molded chip scale package (MCSP) with thick backside metallization |
Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Zhiqiang Niu, Guo Feng Lian |
2016-12-13 |
| 9472491 |
Semiconductor package with small gate clip and assembly method |
Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Ming-Chen Lu, Hongtao Gao |
2016-10-18 |
| 9437587 |
Flip chip semiconductor device |
Xiaotian Zhang, Hamza Yilmaz, Xiaoguang Zeng, Ming-Chen Lu |
2016-09-06 |
| 9437530 |
Combined packaged power semiconductor device |
Yueh-Se Ho, Hamza Yilmaz, Yan Yun Xue |
2016-09-06 |
| 9437528 |
Dual-side exposed semiconductor package with ultra-thin die and manufacturing method thereof |
Yuping Gong, Xiaoming Sui, Yan Yun Xue |
2016-09-06 |
| 9431328 |
Power device and preparation method thereof |
Hamza Yilmaz, Yan Xun Xue |
2016-08-30 |
| 9425181 |
Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures |
Hamza Yilmaz, Yan Xun Xue, Peter H. Wilson, Yan Huo, Zhiqiang Niu +1 more |
2016-08-23 |
| 9412684 |
Top exposed semiconductor chip package |
Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Anup Bhalla, Kai Liu |
2016-08-09 |
| 9397029 |
Power semiconductor package device having locking mechanism, and preparation method thereof |
Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, De Mei Gong |
2016-07-19 |
| 9391005 |
Method for packaging a power device with bottom source electrode |
Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Lei Shi, Liang Zhao +1 more |
2016-07-12 |
| 9337131 |
Power semiconductor device and the preparation method |
Yan Huo, Hamza Yilmaz, Ming-Chen Lu, Zhi Qiang Niu, Yan Xun Xue +1 more |
2016-05-10 |
| 9318603 |
Method of making a low-Rdson vertical power MOSFET device |
Yi Su, Daniel Ng, Anup Bhalla |
2016-04-19 |
| 9318424 |
MCSP power semiconductor devices and preparation methods thereof |
Zhiqiang Niu, Hamza Yilmaz, Hongtao Gao |
2016-04-19 |
| 9305870 |
Power semiconductor device and preparation method thereof |
Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho |
2016-04-05 |
| 9293397 |
Power device and preparation method thereof |
Hamza Yilmaz, Yan Xun Xue |
2016-03-22 |
| 9281265 |
Packaging structure of a semiconductor device |
Yueh-Se Ho, Yan Xun Xue, Lei Shi, Liang Zhao, Ping Huang |
2016-03-08 |
| 9269699 |
Embedded package and method thereof |
Zhiqiang Niu, Hua Pan, Ming-Chen Lu, Yueh-Se Ho |
2016-02-23 |
| 9245861 |
Wafer process for molded chip scale package (MCSP) with thick backside metallization |
Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Zhiqiang Niu, Guo Feng Lian +2 more |
2016-01-26 |
| 9230949 |
Method of making stacked multi-chip packaging structure |
Xiaotian Zhang, Hua Pan, Ming-Chen Lu, Hamza Yilmaz |
2016-01-05 |