Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425181 | Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter H. Wilson, Zhiqiang Niu +1 more | 2016-08-23 |
| 9337127 | Ultra-thin semiconductor device and preparation method thereof | — | 2016-05-10 |
| 9337131 | Power semiconductor device and the preparation method | Hamza Yilmaz, Jun Lu, Ming-Chen Lu, Zhi Qiang Niu, Yan Xun Xue +1 more | 2016-05-10 |
| 9245831 | Top-exposed semiconductor package and the manufacturing method | Zhi Qiang Niu, Ming-Chen Lu, Hongtao Gao | 2016-01-26 |